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Our Company Has Developed Roll to Roll Magnetron Sputtering Type Vacuum Metallizer
What’s the working principle of roll to roll magnetron sputtering type vacuum metallizing machine?
Magnetron sputtering type vacuum metallizing machines rely on the interaction between electric fields, magnetic fields, and ionized gas particles to bombard material from a solid target (the source of the coating) onto a substrate.
When the vacuum chamber is evacuated to a high vacuum environment, inject an inert gas into the chamber, usually argon (Ar). A high-voltage DC power supply is applied between a cathode target (the material to be deposited) and anode. The voltage ionizes argon atoms, stripping electrons to create a plasma of positively charged argon ions (Ar⁺) and free electrons.
Argon ions (Ar⁺) in the plasma are accelerated by the electric field toward the negatively charged target. When ions collide with the target, they transfer momentum to its atoms ejecting them into the vapor phase. These ejected target atoms then travel and condense on the substrate, forming a uniform, dense, and adherent thin film.
The key feature of magnetron sputtering lies in the use of a magnetic field, produced by magnets arranged behind the target. This magnetic field traps electrons near the target surface, forcing them to follow helical paths. This confinement increases the electron-ion collision probability, enhancing plasma density and ionization efficiency. As a result, a higher flux of ions strikes the target, significantly boosting the sputtering rate compared to conventional sputtering methods.
What’s the advantages of magnetron sputtering?
High-Quality Films: Produces dense, low-defect, uniform films with excellent adhesion due to the high deposition rate.
Material Versatility: Compatible with metals, alloys, ceramics.